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NEW PRODUCT SPEC SHEET

R-th

0.22

0.25

0.28

0.31

10 15 20 25 30 35 40

Airflow Rate (CFM)

Thermal Resistance (°c/w)

R-th

Model Number: K520

• Recommend for Intel® Core™ i5 I5-750; Xeon® Processor 3400 Series; Core™ i7 Processors

I7-870 & I7-860; Socket LGA1156

• Passive Heat Sink for 2U Server

Overall Specification:

• Dimension: 90.0 x 90.0 x 64.0 mm

• Weight: 485g

• Material: Aluminum 6063 (99.94%) Extrusion

• Cooler Mounted in Captive design

• Back Strip Set is included

• Thermal Grease Pre-Printed with GE-Toshiba TIG830SP

• Support CPU Power up to 95 Watts

Passive Cooler K520 Cooling Performance VS. Airflow (Wind Tunnel Simulation):

9/15/2009 Lang

NEW PRODUCT SPEC SHEET R-th0.220.250.280.3110 15 20 25 30 35 40Airflow Rate (CFM)Thermal Resistance (°c/w)R-th Model Nu

Brak uwag

Dynatron 88885179 Arkusz Danych