Dynatron 88885149 Arkusz Danych Pobierz pdf (Strona 1)

NEW PRODUCT SPEC SHEET

Thermal Performance Chart

0.448

0.393

0.352

0.32

0.295

0.28

0.31

0.34

0.37

0.4

0.43

0.46

0 1013161922

Wind Tunnel Simulation (CFM)

Thermal Resistance (°c/w)

Model Number: K1

• Recommend for Intel® Core™ i5 I5-750; Xeon® Processor 3400 Series; Core™ i7 Processors

I7-870 & I7-860; Socket LGA1156

• Passive Heat Sink for 1U Server

Overall Specification:

• Dimension: 95.0 x 95.0 x 26.5 mm

• Weight: 300g ±5g

• Material: Aluminum with Skiving Fins

• Captive mounting design

• Back Strip is Included

• TIG830SP Thermal Grease Pre-Printed

• Support CPU Power up to 85Watts

Passive Cooler K1 Cooling Performance VS. Airflow (Wind Tunnel Simulation):

NEW PRODUCT SPEC SHEET Thermal Performance Chart0.4480.3930.3520.320.2950.280.310.340.370.40.430.460 1013161922Wind Tunnel

Brak uwag

Dynatron 88885149 Arkusz Danych Strona 1